Semiconductors and chiplets
Interconnect and device modelling, scored against measured behaviour.
Why prediction accuracy matters here
Chip packaging decisions lock in cost and performance early. Trusting a simulation only after it agrees with measurements saves costly re-spins.
What we could explore together
Compare simulated signal and thermal results with published measurements, and record which version of a model produced which design choice.
LMMEF is under development and our patent is pending, not granted. We make no claim of certification, regulatory approval or guaranteed results in this field.